What is the solder bumping process?
To electroplate the conductive material onto the wafer pad is abbreviated bumping . It can be classified into golden bumping and solder bumping. It utilizes thin film deposition, photolithography and plating techniques to place solder or gold onto IC lead pads. The wafer solder bump process is to produce the solder bumping of the wafer pad. Then it is going to melt the bumping by heat in assembly. This technology can substantially reduce IC size and have the advantages such as high density, low sensitivity, low cost and effective heat dissipation. This bumping process is suitable for flip chip assembly for LCD, memories, microprocessors, and microwave RF ICs applications. The process includes sputter UBM(under Bump Metallurgy), Photolithography, Plating and Etching etc., This bumping is suitable to apply on TAB, Flip Chip.